EM TIC 3X Configurable Ion Beam Milling System
Create high-quality milling surfaces using three broad beams, revealing true sample structures for downstream Electron Microscopy analysis. Adaptable and flexible, the EM TIC 3X supports a broad range of experiments with easily exchangeable stages and sample holder compatibility.
For research use only
Pristine surfaces empower users to obtain relevant results
Prepare high quality surface of various sample types, no matter if hard, soft, brittle, heterogenic, or heat sensitive. EM TIC 3X helps reveal internal sample structures producing pristine surface quality.
- Create high-quality milling surfaces using three broad beams, without the need of stage rotation.
- Obtain largest cross section area to reach highest analyses yield.
- Choose from five stages and multiple sample holders.
Easily prepare buried structures
Never miss your target structure – even if it's a buried feature. Precisely align the sample with mask and ion guns using a stereo microscope. Observe and document the entire process.
Efficiently prepare foil samples
Prepare cross-sections of single or multiple layers of foils with minimal redeposition or delamination. Successfully mill a variety of foil types to eliminate the artifacts from mechanical preparation and enable high-resolution SEM analysis of battery components.
Simply bring your sample through the workflow
Increase efficiency and reduce handling steps with sample support compatibility. Use the same holder for EM TXP and EM TIC 3X for the whole surface preparation workflow. Keeping consistent sample mounting and orientation through the entire preparation process decreases the risk of sample damage and misalignment.
Enable a new range of experiments as needed
Get a new stage to expand your range of experiments, with no need for service support or instrument downtime, even for cryo stages.
- Standard stage
- Multiple-sample stage
- Rotary stage
- Cooling stage
- Vacuum Cryo Transfer Docking Station
EM TIC 3X is compatible with other Leica instruments including EM VCT500 and EM ACE600.
Precise Surface Preparation. Simplified by Design.
Reveal true structure and composition of the sample
EM TIC 3X prepares buried structures for EM analysis providing pristine surface quality, aligning samples precisely, and efficiently milling multi-layered foils with minimal redeposition and delamination.
Surface preparation workflow connectivity
Maintain consistent sample orientation and support. Use the same holder for EM TXP and EM TIC 3X, increasing efficiency and reducing handling steps. Ensure accuracy and efficiency throughout the surface preparation workflow.
Simple by design, configure and expand to your needs
Enable new experiments with easily exchangeable stages. Achieve desired outcomes through intuitive design, reducing errors and setup time. Expand EM TIC 3X without downtime.
EM CTD Cryo Tool Drying
Dry forceps and sample holders fast with heated airflow and a 50°C heating plate. Reach inner surfaces without damage. Request a quote today!
EM TXP Cross-Sectioning Device
Mechanical cross sectioning device for milling, sawing, grinding and polishing samples prior to SEM, TEM and LM examination. Request a quote today.
EM VCT500 Vacuum Cryo Transfer System
Transfer samples under cryogenic or room temperature conditions with vacuum or protected atmosphere. Active cooling and valve control included. Get quote!
EM ACE600 Sputter Coater
EM ACE600 delivers automated carbon and sputter coating with reproducible thin films for electron microscopy analysis. Request a quote today.